OUR PROJECTS
PHOSPACK collaborates with primary foundries for the fabrication of Glass Interposers and TGVs.
Glass interposers are realized with microstructured glass wafers, RDLs interconnected with advanced metalized TGVs, also suitable for cryogenic operations in quantum photonic packaging.
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OFFICE LINE
+358 40 701 6494
WORKING HOURS
9:00am – 6:00pm
OFFICE LINE
+358 40 701 6494
WORKING HOURS