40+ years´dedication to E/O Interconnection Technologies, and Packaging Design.
Project management and risk assessment in critical photonic products development.
OFFICE LINE
+358 40 701 6494
CONTACT US:
info@phospack.com
OFFICE LINE
+358 40 701 6494
CONTACT US
info@phospack.com
The Founder Vision
At PHOSPACK, we believe an intimate relationship exists between Science, Technology, Engineering, Art, Mathematics (STEAM), and Value creation.
PHOSPACK offers design & prototyping services suitable for Co-Packaged Optics and Quantum Photonics packaging.
We harbour the ambition to exploit STEAM with entrepreneurship, enabling Innovation and Know-How.
Passion for E/O interconnection technologies and a strong commitment to customer success are fueling this vision while creating innovative products that improve people’s lives.
Mission
PHOSPACK aims to create Impact and Excellence in Electro-Optical Interposers for Advanced Semiconductor and Photonic Packaging.
ACTIVITIES & PROJECTS
- E/O Interconnection design and prototyping include:
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fiber optic coupled ports on PIC, (e.g. Vgroove edge coupling, microlensed vertical coupling, etc.)
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Ohmic contact design
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Pad metallurgies suitable for cryogenic applications
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Electrical routing layout (RDL).
OFFICE LINE
+358 (0)40 701 6494
CONTACT US:
info@phospack.com
OFFICE LINE
+358 40 701 6494
CONTACT US:
info@phospack.com