OUR PROJECTS
PHOSPACK collaborates with primary foundries for the fabrication of Silicon Interposers and TSVs.
Glass interposers are realized with microstructured glass wafers, multilayers RDL, and advanced metalized TGVs, also suitable for cryogenic operations in quantum photonic packaging.
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OFFICE LINE
+358 40 701 6494
WORKING HOURS
9:00am – 6:00pm
OFFICE LINE
+358 40 701 6494
WORKING HOURS