Quantum photonic packaging

PHOSPACK would contribute to Quantum photonic packaging with solutions to enhance the integration and scalability of Quantum Processors and Quantum Sensors through innovative Electro/Optical (E/O) Interconnections among Single-Photon sources & detectors, SQUIDs, TES, LNAs etc., to ensure functionalities and reliability.

In particular:

  • Electrical Interconnection:

    Correct materials selection, ensuring superconductive wire bonding and flipchip bonding, minimizing losses or decoherence.

  • Precision Alignment:

    Accurate alignment of optical components to maintain the integrity of photon pathways and ensure efficient coupling between elements.

  • Thermal and Environmental Stability:

    Packaging solutions must provide robust thermal management and shielding to preserve Quantum States at their critical operating temperatures.

  • Scalability and Miniaturization:

    The packaging must support the integration of multiple components in a compact form factor, similar to co-packaged optics (CPO), enabling scalable quantum systems.

  • System reliability:

    Provides packaging and E/O interconnections stability and endurance among several ambient-to-critical operating temperature cyclings