PHOSPACK specialize in Electro-Optical interposers prototyping service that heterogeneously or hybridly integrate electronic and optical components seamlessly, on Glass or Silicon wafers (100, 150 and 200mm).
PHOSPACK offers cutting-edge solutions for developing advanced photonic systems. Our team of designers and technologists utilizes state-of-the-art interconnection technologies and processes on Glass or Silicon, at the wafer level, to ensure prototypes meet customer specifications and reliability standards, ready to scale up for volume production.
PHOSPACK Lean-based design & prototyping service is based on understanding customer needs and a systematic approach to accelerate the customer´s product development cycle.
PHOSPACK would contribute to enhance your competitive edge in the market, improving efficiency in the execution time and processes