E/O Interposers design on glass and silicon

Glass and Silicon interposers

Designing advanced electronic and optical (E/O) systems, glass and Silicon Interposers are playing a vital role particularly for 2.5D and 3D integration.

• Glass Interposers provide excellent electrical insulation, low dielectric constant, ideal for RF applications, and thermal expansion matching with other materials. They are available in standard wafer sizes or panels, for larger sizes and lower manufacturing costs.
• Silicon Interposers are the best compatible option for semiconductor processes. They provide high mechanical strength and are ideal for high-density interconnections. However, they can be more expensive than similar glass-made solutions and may require high sheet-resistivity silicon or additional thick oxide layers to improve RF signal fidelity in Re-Distribution Layer design (RDL).

PHOSPACK provides Redistribution Layer (RDL) design and interposer prototyping with vertical and horizontal interconnection techniques such as Through-Silicon Vias (TSVs), Through-Glass Vias (TGVs) and micro-bumping. Each material is chosen balancing specific application requirements and factors like thermo-mechanic properties, RF performance, and cost.