Co-Packaged Optics (CPO) is an advanced heterogeneous or hybrid integration of integrated optics and electronic chips (e.g. ASICs) on a single substrate (interposer) addressing Tb/s aggregated bandwidth.
CPO aims to improve Signal Integrity by minimizing the signal path from node to node while lowering power consumption.
The focus is on optimizing physical horizontal and vertical interconnections (respectively RDLs and TGVs or TSVs ) between photonics (e.g. integrated optics, diode lasers, photodetectors, etc.) and electronic elements (e.g. drivers, TIA, ASICs and passives), delivering solutions with improved bandwidth utilization and thermal management
PHOSPACK would contribute to CPO exploitation with glass (or silicon) interposer design and prototypes under a lean process and a quick turnaround.