PHOSPACK specializes in the design and fabrication of Glass Multilayer Interposers (GMI), enabling E/O interconnections between various chiplets, ensuring Signal and Power Integrity among RDLs, and providing optimal thermal management solutions.
PHOSPACK supports customers to accelerate their development timelines and bring innovative products to market with confidence.
Our services include:
- CUSTOM DESIGN ONLY All provided GMI design solutions are custom-made to meet specific component and system-level Performance, Power, Area, and Cost (PPA&C) requirements,
- PROTOTYPING Under a lean process, PHOSPACK offers a quick turnaround for prototype delivery and prototype iterations allowing teams to refine their ideas through repeated cycles of testing and feedback. Each iteration provides an opportunity to assess the functionality, usability, and overall effectiveness of the prototype.
- MATERIAL SELECTION Expertise in selecting the right materials that enhance performance while maintaining cost-effectiveness
- TESTING & VALIDATION Selection of GMI Test-Vehicles (Demonstrators) to reduce costly design iterations and speed up validation processes in the fab.
- CONSULTATION Expert guidance throughout the prototyping process, from initial concept to final product.